Material: Electrolytic Tough Pitch (ETP) Copper | Document Version: 2.0 | Date: June 2025
Material Identification
| Designation System | Code | Referencia estándar |
|---|---|---|
| UNS Number | C11000 | ASTM B124/B152 |
| European Standard | CW004A | EN 1412 |
| Estándar japonés | C1100 | JIS H3100 |
| ISO Designation | Cu-ETP | ISO 1634-1 |
Chemical Composition (wt%)
| Elemento | Mínimo | Máximo | Típico | Notas |
|---|---|---|---|---|
| Copper + Silver | 99,90 | - | 99.95 | Primary constituent |
| Oxygen | 0.015 | 0.040 | 0.025 | 150-400 ppm as Cu₂O |
| Plata | - | 0.030 | 0.015 | Counted in copper total |
| Dirigir | - | 0.005 | 0.002 | Control de impureza |
| Planchar | - | 0.005 | 0.002 | Control de impureza |
| Estaño | - | 0.002 | <0.001 | Control de impureza |
| Zinc | - | 0.002 | <0.001 | Control de impureza |
| Total Other Impurities | - | 0.050 | 0.020 | Excluding oxygen |
Physical Properties at 20°C
| Propiedad | Metric Value | Imperial Value | Método de prueba |
|---|---|---|---|
| Propiedades electricas | |||
| Conductividad eléctrica | ≥58 MS/m (100% IACS) | ≥100% IACS | ASTM E1004 |
| Resistividad electrica | 1.724 µΩ·cm | 6.79 µΩ·in | ASTM B193 |
| Temperature Coefficient | 0.00393 /°C | 0.00218 /°F | - |
| Propiedades termales | |||
| Conductividad térmica | 390 W/m·K | 270 BTU·ft/(h·ft²·°F) | ASTM E1461 |
| Capacidad calorífica específica | 0.385 J/g·K | 0.092 BTU/(lb·°F) | - |
| Thermal Expansion (20-300°C) | 16.5 × 10⁻⁶ /°C | 9.2 × 10⁻⁶ /°F | ASTM E228 |
| Physical Constants | |||
| Densidad | 8.94 g/cm³ | 0.323 lb/in³ | - |
| Punto de fusion | 1,083°C | 1,981°F | - |
| Modulos elasticos | 117 GPA | 17,000 ksi | ASTM E111 |
| El coeficiente de Poisson | 0.34 | 0.34 | - |
Propiedades mecánicas
Annealed Condition (O60/O61)
| Propiedad | Rango de valor | Típico | Estándar de prueba |
|---|---|---|---|
| Resistencia a la tracción | 210-250 MPa | 230 MPa | ASTM E8/E8M |
| 0.2% Yield Strength | 70-100 MPa | 85 MPa | ASTM E8/E8M |
| Elongation (50mm gauge) | 45-55% | 50% | ASTM E8/E8M |
| Rockwell Hardness | 45-65 HRB | 55 HRB | ASTM E18 |
Cold-Worked Tempers
| Templar | Reduction (%) | UTS (MPa) | YS 0.2% (MPa) | Elongación (%) | Dureza (HRB) |
|---|---|---|---|---|---|
| H02 | ~ 25 | 300 | 200 | 25 | 70 |
| H04 | ~ 50 | 350 | 280 | 10 | 85 |
| H08 | ~75 | 400 | 320 | 5 | 95 |
Fatigue Properties
| Test Condition | Endurance Limit | Cycles | Notas |
|---|---|---|---|
| Rotating Beam (R = -1) | ~90 MPa | 10⁷ | Temperatura ambiente |
| Axial Load (R = 0.1) | ~120 MPa | 10⁷ | Annealed condition |
Características de fabricación
| Proceso | Idoneidad | Parameters/Notes |
|---|---|---|
| Forming Operations | ||
| Dibujo en frío | Excelente | Deep drawing ratio r̄ ≈ 2.0 |
| Doblado | Excelente | Min. bend radius = 1t (annealed) |
| Estampado | Excelente | Clean blanking possible |
| Trabajo en caliente | Bien | Temperature range: 700-900°C |
| Joining Methods | ||
| Soft Soldering | Excelente | Use rosin-based flux |
| Silver Brazing | Excelente | Preferred for HVAC applications |
| Soldadura por resistencia | Justo | Control expulsion |
| TIG/MIG Welding | Limitado | Porosity issues |
| Soldadura por fricción y agitación | Bien | Solid-state process |
| Mecanizado | ||
| General Machinability | Bien | Tool life index: 20 (Brass = 100) |
| Recommended Speed | 120 m/min | Carbide tools with flood coolant |
Resistencia a la corrosión
| Ambiente | Rendimiento | Corrosion Rate | Comments |
|---|---|---|---|
| Atmosphere (Urban) | Excelente | <0.01 mm/year | Forms protective oxide |
| Agua dulce | Excelente | <0.005 mm/year | Suitable for potable water |
| Seawater (static) | Bien | 0.02-0.05 mm/year | Copper-nickel preferred >2 m/s |
| Neutral Soil | Bien | Variable | PE sleeve in acidic conditions |
| Reducing Atmospheres | Pobre | - | Risk of hydrogen embrittlement |
Aplicaciones por industria
| Sector industrial | Aplicaciones Típicas | Key Requirements Met |
|---|---|---|
| Electrical Power | Busbars, switchgear contacts, transformer windings | High conductivity, reliability |
| Electrónica | PCB traces, connectors, RF components | Conductivity, solderability |
| HVAC/Refrigeration | Heat exchanger tubes, refrigerant lines | Thermal conductivity, corrosion resistance |
| Construcción | Plumbing, roofing, architectural elements | Durability, formability, aesthetics |
| Automotor | Radiators, brake lines, electrical harnesses | Heat transfer, vibration resistance |
| Marina | Heat exchangers, piping systems | Seawater compatibility |
Applicable Standards
| Organización | Número estándar | Descripción |
|---|---|---|
| ASTM International | ||
| B124 | Copper and Copper Alloy Bars and Rods | |
| B152 | Copper Sheet, Strip, and Rolled Bar | |
| B187 | Copper Busbar | |
| B188 | Seamless Copper Tube | |
| B837 | Seamless ID-Controlled Copper Tube | |
| European Standards | ||
| EN 13599 | Copper and Copper Alloys – Chemical Composition | |
| EN 13601 | Copper Rod, Bar and Wire for Electrical Purposes | |
| International Standards | ||
| ISO 1634-1 | Wrought Copper – Chemical Composition | |
| ISO 2009 | Copper and Copper Alloys – Cast Products | |
| Japanese Standards | ||
| JIS H3100 | Copper and Copper Alloy Sheets and Strips | |
| ÉL H3250 | Copper and Copper Alloy Seamless Pipes and Tubes |
Quality Control Testing
| Test Category | Método | Frecuencia | Criterios de aceptación |
|---|---|---|---|
| Análisis químico | |||
| Copper Content | OES/AAS | Each heat | ≥99.90% (incl. Ag) |
| Oxygen Content | Inert gas fusion | Each heat | 0.015-0.040% |
| Prueba mecánica | |||
| Tensile Properties | ASTM E8/E8M | Per lot | Per specification |
| Dureza | ASTM E18 | Per coil/bar | Per specification |
| Electrical Testing | |||
| Conductividad | ASTM E1004 | Per lot | ≥100% IACS |
| Dimensional Control | |||
| Thickness/Diameter | Micrometry | Continuo | ±tolerance |
| Non-Destructive Testing | |||
| Calidad de la superficie | Eddy current | As required | No detectable defects |
Storage and Handling
| Parámetro | Recomendación | Razón fundamental |
|---|---|---|
| Entorno de almacenamiento | Dry, ventilated area | Prevent tarnishing |
| Humidity Control | <60% RH | Minimize oxidation |
| Temperatura | Ambient | Avoid thermal cycling |
| embalaje | Moisture barrier, VCI paper | Corrosion prevention |
| Manejo | Clean gloves, avoid scratching | Maintain surface quality |
Technical Notes
Oxygen Content Impact:
- Enhances recrystallization and grain refinement
- Provides balanced strength-ductility relationship
- Slightly reduces conductivity vs. oxygen-free copper
- Risk of hydrogen embrittlement in reducing atmospheres
Temperature Limitations:
- Softening begins around 200°C
- Creep considerations above 150°C for long-term loading
- Recrystallization temperature: 200-300°C depending on cold work
Design Considerations:
- Coefficient of thermal expansion must be considered in multi-material assemblies
- Galvanic compatibility with other metals in wet environments
- Joint design critical for high-current applications
Document prepared in accordance with: ASTM, EN, ISO, and JIS standards
For additional technical support: Contact your material supplier or accredited testing laboratory